焊接电气连接器SOLDERING ELECTRICAL CONNECTIONS
1. INTRODUCTION 介绍
A. The data in this subject comes from Boeing Process Specifications BAC5242 (which supersedes BAC5044), BAC5065 (which supersedes BAC5046) and BAC5155. The airline has a copy of the Boeing Process Specification Manual.
本主题中的数据来自波音工艺规范 BAC5242（取代 BAC5044）、BAC5065（取代 BAC5046）和 BAC5155。航空公司拥有一份波音工艺规范手册。
B. The data is general. It is not about all situations or specific installations. Use this data as a guide to help you write minimum standards.
数据是通用的。它不涉及所有情况或特定安装。请将此数据作为指南，帮助您编写最低标准。
C. For soldering of surface mounted devices refer to SOPM 20-11-07.
关于表面安装设备的焊接，请参考 SOPM 20-11-07。
D. Refer to SOPM 20-00-00 for a list of all the vendor names and addresses.
请参阅 SOPM 20-00-00，了解所有供应商的名称和地址。
2. MATERIALS 材料
A. Solder alloys (ANSI/J-STD-006)
焊料合金（ANSI/J-STD-006）
(1) Tin/lead wire form with rosin flux
锡/铅导线，松香助焊剂
(a) Sn60WRP2 (ANSI/J-STD-006, Type W-(Sn60A or Sn60C or Pb40A)-ROL0-4)
(b) Sn60WRP3 (ANSI/J-STD-006, Type W-(Sn60A or Sn60C or Pb40A)-ROL0-6 or -7)
(c) Sn63WRP2 (ANSI/J-STD-006, Type W-(Sn63A or Sn63C or Pb37A)-ROL0-4)
(d) Sn63WRP3 (ANSI/J-STD-006, Type W-(Sn63A or Sn63C or Pb37A)-ROL0-6 or -7)
(2) Tin/lead wire form with mildly activated flux
锡/铅导线，轻度活化助焊剂
(a) Sn60WRMAP2 (ANSI/J-STD-006, Type W-(Sn60A or Sn60C or Pb40A)-ROL1-4)
(b) Sn60WRMAP3 (ANSI/J-STD-006, Type W-(Sn60A or Sn60C or Pb40A)-ROL1-6 or -7)
(c) Sn63WRMAP2 (ANSI/J-STD-006, Type W-(Sn63A or Sn63C or Pb37A)-ROL1-4)
(d) Sn63WRMAP3 (ANSI/J-STD-006, Type W-(Sn63A or Sn63C or Pb37A)-ROL1-6 or -7)
(3) Tin/silver wire form with mildly activated flux, high temperature
锡/银导线，温和活化助焊剂，高温
(a) Sn96WRMAP2 (ANSI/J-STD-006, Type W-(Sn96A-ROL1-4)
(b) Sn96WRMAP3 (ANSI/J-STD-006, Type W-(Sn96A-ROL1-6 or -7)
B. Fluxes (ANSI/J-STD-004)
焊剂
(1) Non activated — Kester 135, V14597
(2) Mildly activated — Kester 197, V14597, or Almit RF-35-RMA
C. Solvents
溶剂
(1) Isopropyl Alcohol — TT-I-735
D. Abrasives
磨料
(1) Aluminum oxide cloth
(2) Emery cloth or paper, wet or dry, 320-400 grit
(3) Scotch-Brite pads, Type A, Very Fine, V78381
E. Hand Lotions
手乳液
(1) North 212 Skin Conditioner, V11392
(2) I.C. Lotion, V0KDZ6
F. Tools to Heat Shrink Solder Sleeves
热缩套管的工具
(1) Infrared Heat Guns
红外热枪
(a) Raychem IR500 with RG-2 reflector or 993709 tubing reflector, V06090
(b) Raychem IR550 Mark II with RG-2 reflector, V06090
(c) Raychem IR1000 or IR1003 Zap Gun, V06090
(d) Boeing ST2021C or ST2021J hand model or ST2021D bench model
(2) Hot air heat guns
热风枪
(a) Raychem AA-400, V06090
(b) Raychem CV-5300 with MG-1 reflector, V06090
(c) Raychem CV-5700 Mini Gun 3 with MG-7 reflector, V06090
G. Resistance Soldering Equipment — Contact (V07015) Model H-101-CD-T-103
电阻焊接设备- Contact (V07015) Model H-101-CD-T-103
3. GENERAL 通用
A. Solder in a room that is as clean as Class 1,500,000 of BAC5703, with 66-84°F air temperature and a maximum relative humidity of 65%. If the relative humidity goes below 30%, use the procedures for electrostatic discharge sensitive (ESDS) control per BAC5485 (Ref SOPM 20-12-02). A BAC5703 Class 1,500,000 controlled area has these properties:
在清洁度达到 BAC5703 的 1,500,000 级、空气温度为 66-84°F 和最大相对湿度为 65% 的房间内进行焊接。如果相对湿度低于 30%，则使用 BAC5485 (Ref SOPM 20-12-02)规定的静电放电敏感 (ESDS) 控制程序。BAC5703 1,500,000 级控制区具有以下特性：
(1) Persons are permitted to eat, drink or smoke only in specified areas away from the work stations or airplane components.
只允许在规定的区域内进食、饮水或吸烟，远离工作站或飞机部件。
(2) Work stations must be visually clean from a distance of 2-3 feet.
工作站必须在 2-3 英尺的距离内保持清洁。
(3) The air pressure of the atmosphere inside must be kept higher than the areas outside.
室内空气压力必须高于室外。
(4) If shop coats are necessary, they must not be worn with the garment open or sleeves rolled-up to expose personal clothes.
如必须穿工作服，则不得敞开或卷起袖子露出个人衣物。
(5) If finger cots or gloves are necessary, they must be removed when persons go out of the controlled area. Gloves must be replaced when visually dirty. Finger cots must be discarded after they are used.
如需穿戴指套或手套，则必须在人员离开受控区域时脱掉。手套脏了必须更换。指套用完后必须丢弃。
B. Only the approved hand lotions can be used by soldering technicians during these procedures. Contamination from other hand lotions, perfumes and cosmetics, which could possibly not be seen during inspection, can cause hardware failure during environmental tests. Before you touch the hardware, wash all such materials from your hands and rinse with clean water. Then you can apply the approved hand lotions, if necessary.
在这些程序中，焊接技师只能使用经批准的洗手液。其他洗手液、香水和化妆品造成的污染在检查过程中可能看不出来，但在环境测试过程中会导致硬件故障。在接触硬件之前，请洗净手上的所有此类物质，并用清水冲洗干净。然后，如有必要，可以使用经认可的洗手液。
C. White cotton or nylon gloves are recommended during soldering operations. Finger cots can be used if bare skin will not touch parts.
建议在焊接操作过程中使用白色棉或尼龙手套。如果裸露的皮肤不会接触到零件，可以使用指套。
D. Keep the soldering tip tight in the heating element. Keep the tip clean and coated with a continuous layer of solder. A small amount of solder can be applied to the tip as necessary.
使焊头紧贴加热元件。保持焊头清洁并涂上一层连续的焊料。必要时可在焊头上涂抹少量焊料。
E. Soldering Iron Temperature Control — Usually, if the soldering iron is operated at the specified voltage, temperature control is not necessary. But if the iron is kept on at full heat a long time and not kept clean, oxides could occur on the tip and cause contamination and corrosion. This problem could be decreased if the temperature is decreased while the iron is not used, but you must make sure the iron is back at full heat before you start to solder again.
烙铁温度控制 — 通常情况下，如果烙铁是在规定的电压下工作，就没有必要进行温度控制。但如果烙铁长时间处于全热状态且不保持清洁，烙铁头上可能会产生氧化物，从而造成污染和腐蚀。如果在不使用烙铁的情况下降低温度，则可以减少这一问题，但必须确保在重新开始焊接之前烙铁已恢复全热。
F. Preparation of Conductors and Terminals
导体和端子的准备
(1) Remove a sufficient length of insulation from the wire to permit an inspection gap between the end of the insulation and the end of the solder on the bare conductor after the connection is soldered. As a minimum, the insulation must not be included in the solder. As a maximum, the gap must be the larger of 0.060 inch or 2 wire diameters (insulation included), but not that long that a short circuit with adjacent conductors could occur.
从导线上切除足够长的绝缘层，以便在焊接连接后在绝缘层末端和裸导体上的焊料末端之间留出检查间隙。最低限度，绝缘层不得包括在焊料中。最大间隙必须为 0.060 英寸或 2 个导线直径（包括绝缘层）中的较大者，但不能过长，以免与相邻导体发生短路。
(2) Keep the wire stripper tools visually clean. Repair or replace tools that get mechanical damage.
保持剥线工具的外观清洁。修理或更换有机械损伤的工具。
(3) Some scraped wire strands are permitted if there is no bare metal. Bare metal is permitted on the cut ends of the wires. Broken strands are permitted, within the limits specified in BAC5044, unless the wire will be used at 6,000 volts or more.
如果没有裸金属，允许刮掉一些导线股。导线的切端允许有裸金属。在 BAC5044 规定的范围内，允许断股，除非电线将在 6000 伏或更高电压下使用。
(4) The insulation must not be burnt, frayed, split, punctured or crushed, when examined visually without magnification.
在无放大镜的情况下目测绝缘不得烧焦、磨损、裂开、刺破或压碎。
(5) Clean the wires, part leads and terminals (but not flatpacks) as necessary, to be sure the solder will make a good bond. Remove oxides, tarnish, and other contamination with rubber erasers, fiberglass rods, tinned copper shield braid, or abrasive material. Hold the part leads tightly between the body and the surface to be cleaned. Be careful not to bend or put stress on the joint between the wire and the body of the part. Then clean the surfaces with isopropyl alcohol.
必要时清洁导线、零件引线和端子（但不包括扁平封装），以确保焊料能良好结合。用橡皮擦、玻璃纤维棒、镀锡铜屏蔽编织物或研磨材料清除氧化物、污垢和其他污染物。将零件引线紧紧夹在机身和待清洁表面之间。注意不要弯曲导线与零件主体之间的连接处或使其受力。然后用异丙醇清洁表面。
(6) When you attach part leads to lugs or terminals or parts bonded to a circuit board, make a stress-relief bend in each lead. Only one of the two leads must be bent if the part will not be bonded, or not to be given a conformal coating. Hold the lead between the part body and the bend to prevent stress in the wire joint at the body. Start the bend no nearer than 0.03-inch from the part body.
将零件引线连接到接线片、端子或粘接到电路板上的零件时，应在每根引线上做一个消除应力的弯曲。如果不对零件进行粘接或不进行保形涂层，则必须只弯曲两条引线中的一条。将引线夹在零件本体和弯曲处之间，以防止本体上的导线接头处产生应力。开始弯曲时不要离零件本体超过 0.03 英寸。
4. SOLDERING 焊接
A. General
通用
(1) Bend, install, or hold conductors and part leads to not let them move while the hot solder cools and becomes solid.
弯曲、安装或固定导体和零件引线，在热焊料冷却和凝固时不要让它们移动
(2) If the component is identified as heat-sensitive, be sure to install a heat shunt between the body of the part and the location to be touched by the soldering iron tip (Figure 1). Heat shunts can also be used to give protection to insulation when you solder stranded conductors.
如果确定零件对热敏感，应确保在零件主体和烙铁头接触的位置之间安装热分流器（图 1）。在焊接绞合导体时，也可以使用热分流器来保护绝缘。
(3) Apply the soldering iron tip to the connection area to supply a maximum of heat to the metal surfaces to be soldered. But also make sure you give maximum protection to the parts that could be damaged by the heat.
将烙铁头置于连接区域，为待焊金属表面提供最大热量。但也要确保最大限度地保护可能受热损坏的零件。
(4) Wait until the metal surfaces get to the melting temperature of the solder. Then apply solder to the metal surfaces and let it flow into the joint. If possible, do not let the solder wire touch the soldering iron tip.
等到金属表面达到焊料的熔化温度。然后将焊料涂抹在金属表面，让其流入焊点。尽可能不要让焊锡丝接触烙铁头。
(5) On printed circuit boards, keep to a minimum the time and pressure of the soldering iron to prevent damage to the boards, adjacent components, insulation and parts. Do not apply the iron longer than 3 seconds.
在印刷电路板上，应尽量减少烙铁的使用时间和压力，以防损坏电路板、邻近的元件、绝缘层和零件。使用烙铁的时间不要超过 3 秒钟。
(6) If a soldered joint must be heated again, let it cool approximately 30 seconds before you apply the heat again.
如果必须再次加热焊接点，应让其冷却约 30 秒后再加热。
CAUTION ：DO NOT VAPOR DEGREASE, PUT INTO SOLVENT, OR CLEAN WITH WATER UNSEALED COMPONENTS, ENCAPSULATED OR POTTED ASSEMBLIES OR UNSEALED ELECTROLYTIC CAPACITORS.
警告 ：请勿对未密封部件、封装或浇注组件或未密封电解电容器进行蒸汽脱脂、放入溶剂中或用水清洗。
(7) Clean off the flux from the soldered areas and adjacent areas
清除焊接区域和邻近区域的助焊剂
(a) For rosin flux (Type R) use isopropyl alcohol (BAC5225 Type 1, Class 1, 2, or 6). Start to clean the areas within 1 hour after the solder is cool and solid.
对于松香助焊剂（R 型），使用异丙醇（BAC5225 1 型 1、2 或 6 级）。在焊料冷却凝固后 1 小时内开始清洁焊接区域。
(b) For activated flux (Type RMA), use isopropyl alcohol (BAC5225 Type 1, Class 1, 2, or 6) and then the Axarel 32/ECD batch washing system (BAC5225 Type 4, Class 1 or Class 3). Start to clean the areas within 1 hour after the solder is cool and solid, and complete the cleaning in 8 hours.
对于活性助焊剂（RMA 型），使用异丙醇（BAC5225 1 型，1 级、2 级或 6 级），然后使用 Axarel 32/ECD 批次清洗系统（BAC5225 4 型，1 级或 3 级）。在焊料冷却凝固后 1 小时内开始清洗，并在 8 小时内完成清洗。
B. Hand Tinning Procedure
手工镀锡程序
(1) You can use a soldering iron or resistance soldering electrodes to apply heat. If you use the soldering iron, be sure to keep the tip clean and coated with a continuous layer of solder. If you use the electrodes, do not apply or remove them while the power is on.
可以使用烙铁或电阻焊条加热。如果使用烙铁，请务必保持烙铁头清洁，并涂上一层连续的焊锡。如果使用电极，请勿在接通电源时使用或移除电极。
(2) Heat shunts are necessary on all but connectors, wire, terminals, pins or contacts. Keep the jaw faces of the shunts clean of contamination and corrosion. Do not set the iron temperature higher then 700°F.
除了连接器、导线、端子、引脚或插针外，其他所有地方都需要热分流。保持分流器钳口表面清洁，防止污染和腐蚀。熨斗温度不要高于 700°F。
(3) Heat the area to be tinned. Then apply flux-cored solder to make a smooth, continuous shiny surface. Do not let the iron stay on the surface more than a total of 5 seconds during the operation.
加热要镀锡的区域。然后涂上带助焊剂的焊料，使表面光滑、持续发亮。在操作过程中，不要让烙铁在表面上停留超过 5 秒钟。
(4) If necessary, you can do Paragraph 4.B.(3) again, but not more than two more times.
如有必要，可再次执行第 4.B.(3)段，但不得超过两次。
(5) Remove flux residues per Paragraph 4.A.(7) above.
按照上述第 4.A.(7)段清除助焊剂残留物。
C. Soldering to Terminals and Lugs
端子和焊片的焊接
(1) The source data, such as BAC5043, BAC5242, BAC5065, tells how to make connections when the components are built at the factory. For overhaul operations, use the original configurations as a guide. Refer to SOPM 20-11-01 for instructions about how to bend and install the wires and component leads if you cannot tell how to make the connections from the original details. Some details are given in the steps below.
BAC5043、BAC5242、BAC5065 等原始数据说明了组件在工厂制造时的连接方式。对于大修操作，请使用原始配置作为指导。如果无法从原始详细说明中了解如何进行连接，请参阅 SOPM 20-11-01，了解有关如何弯曲和安装导线和组件引线的说明。下面的步骤给出了一些详细说明。
(2) Wrap the wires around the terminals a minimum of 180-degrees unless these are forked terminals or one wire goes through a series of terminals. Do not overlap wraps or wires.
将导线缠绕在端子上至少 180 度，除非这些端子是叉形端子或一条导线穿过一系列端子。不要重叠缠绕或接线。
(3) One continuous wire can be used to connect a series of connectors. At the first and last terminal, attach the wire to the terminal as if this was the only terminal. For the terminals in between, send the wire straight through, and make sure you solder the wire to a minimum of two surfaces of each of these terminals.
可以用一根连续的导线连接一系列连接器。在第一个和最后一个端子上，将导线连接到端子上，如同这是唯一的端子。对于中间的端子，将导线直接穿过，并确保将导线焊接在每个端子的至少两个表面上。
(4) For stress relief, make a bend in the leads of parts attached to or between terminals, as shown in SOPM 20-11-01. When you make the bend, be sure to hold the lead at a point between the part body and the location of the bend.
如 SOPM 20-11-01 所示，在与端子相连或介于端子之间的零件引线上弯曲，以消除应力。在弯曲时，一定要在零件本体和弯曲位置之间的一点夹住引线。
(5) If the distance between two terminals is 0.75-inch or less, you can use solid wire of the same size, as an alternative to stranded wire, but only if the specified wire size is 22-gage or thinner.
如果两个端子之间的距离为 0.75 英寸或更短，可以使用相同规格的实心导线来替代绞合导线，但前提是规定的导线规格为 22 号或更细。
(6) If the terminal or connection will have more than one conductor attached, it is best to solder all of the conductors at the same time.
如果接线端子或连接处将连接多个导体，最好同时焊接所有导体。
D. Soldering to Solder Cups (Figure 2)
焊接到焊杯上（图 2）
NOTE: Resistance heating is preferred, but you can use a soldering iron with or without resistance heating equipment.
注：最好使用电阻加热，但也可以使用带或不带电阻加热设备的烙铁。
(1) Attach resistance electrodes to the outside surface of the solder cup near the bottom while the power to the electrodes is off.
将电阻电极连接到焊杯外表面靠近底部的位置，同时关闭电源。
(2) Energize the resistance electrodes, or use the soldering iron, to apply heat to the outside of the solder cup.
给电阻电极通电，或使用烙铁给焊杯外部加热。
(3) When the cup becomes as hot as the melting point of the solder, melt a sufficient quantity of flux-cored solder in the cup to make a satisfactory fillet after the wires are installed, within the limits shown.
当焊杯的温度达到焊料的熔点时，在焊杯中熔化足够数量的助焊剂焊料，以便在安装导线后在所示范围内形成令人满意的圆角。
(4) Strip and cut the wire to let it fit into the cup to the bottom, as shown. Install the wire as shown. Make sure the melted solder fills the inspection hole, wets the complete circumference of the bottom of the cup interior, and does not overflow the hole. A thin layer on the outside surface of the cup is permitted.
如图所示，将导线剥皮并剪断，使其与焊杯底部相吻合。如图所示安装导线。确保熔化的焊料填满检查孔，润湿杯内底部的整个圆周，且不会溢出检查孔。允许在杯外表面涂上一层薄薄的焊料。
(5) Remove the soldering iron, or turn off the power to the resistance electrodes. Do not remove the electrodes from the cup until the solder cools and becomes solid.
取下烙铁，或关闭电阻电极的电源。在焊料冷却并凝固之前，不要将电极从焊杯中取出。
(6) Remove flux as necessary per Paragraph 4.A.(7).
根据第 4.A.(7)段，必要时去除助焊剂。
(7) For good heat, keep the electrodes and ground connectors tight and clean. Clean the electrode tips as necessary with abrasive of 325-grit or finer and then wipe them with isopropyl alcohol.
为保持良好的发热性能，应保持电极和接地接头的紧固和清洁。必要时用 325 号或更细的砂纸清洁电极头，然后用异丙醇擦拭。
E. Printed Circuit Boards
印刷电路板
(1) Mechanically install the electronic parts on the board per SOPM 20-11-01 and the overhaul instructions. If the unit is identified as electrostatic discharge sensitive (ESDS), refer to SOPM 20-12-02 for special instructions.
按照 SOPM 20-11-01 和大修说明，以机械方式安装电路板上的电子零件。如果设备被确定为静电放电敏感 (ESDS)，请参阅 SOPM 20-12-02 以了解特殊说明。
(2) The soldered connection must not have a frosty, ridged, fluted or grainy finish, unless one or more of these conditions is applicable:
焊接连接不得有霜状、脊状、凹槽状或颗粒状表面，除非出现下列一种或多种情况：
(a) The solder cooled slowly because the component was an unusually large mass of metal.
焊料冷却缓慢，因为元件的金属块异常大。
(b) The conductor was untinned gold.
导体是未镀锡的金。
(c) The joint was exposed to vapor phase reflow.
焊点暴露在气相回流焊中。
(d) The joint was made with high-temperature solder.
焊点使用了高温焊料。
(3) Flux stains of solder surfaces on the component side of the circuit board are acceptable.
电路板元件侧焊料表面的助焊剂污渍是可以接受的。
(4) These solder joint conditions are not acceptable:
这些焊点条件是不可接受的：
(a) Cold solder joint
冷焊点
(b) Too much solder
焊料过多
(c) Flux residue
助焊剂残留
(d) Unwanted matter or contamination in the solder
焊料中含有不需要的物质或污染物
(e) Broken solder joint
焊点断裂
(f) Insufficient or no solder
焊料不足或没有焊料
(g) Rosin, not solder, makes the joint
焊点是松香而不是焊料造成的
(h) Voids
空洞
(i) Disturbed solder joint
焊点受干扰
(j) Too much heat
太热
(5) Bare copper or copper alloys on the lead ends are permitted.
允许在引线端部使用裸铜或铜合金。
(6) Solder can go into the bend radius of a horizontally-installed axial-lead component (such as a resistor) at one or both ends if the solder does not extend outside of the pad diameter.
如果焊料不超出盘直径，水平安装的轴向引线元件（如电阻器）的一端或两端可进入弯曲半径。
(7) Plated-through holes that contain wires or leads must be filled with solder. A depression on one or both sides is acceptable, but cannot be deeper than 25% of the board thickness.
含有导线或引线的镀通孔必须用焊料填满。一侧或两侧的凹陷是可以接受的，但深度不能超过电路板厚度的 25%。
5. IN-PROCESS CORRECTION 过程中校正
A. Solder joints can be touched up or soldered again as necessary. This includes such conditions as too much solder, not sufficient solder, peaks, points (icicles), bridges, spatter, pits, scars, holes and voids.
焊点可根据需要进行润色或重新焊接。这包括焊料过多、焊料不足、峰值、点（冰柱）、桥、飞溅、凹坑、疤痕、孔洞和空隙等情况。
B. Solder connections can be touched up again and again if the results agree with the quality controls of BAC5242. But keep to a minimum the number of times you do this to joints on circuit boards, to prevent damage.
如果结果符合 BAC5242 的质量控制要求，可以反复润饰焊接连接。但要尽量减少对电路板上的焊点进行修补的次数，以防造成损坏。
C. Heat the soldered area and correct the problem as quickly as possible after the solder melts. Add more solder or flux as necessary.
加热焊接区域，并在焊料熔化后尽快纠正问题。必要时添加更多焊料或助焊剂。
D. Unwanted solder can be soaked up with wicking material (Paragraph 5.E.) or a tool that melts the solder and removes it with vacuum (Paragraph 5.F.).
可以用吸芯材料（第 5.E 段）或熔化焊料并用真空去除焊料的工具（第 5.F 段）吸掉多余的焊料。
E. To use wicking material, use shield braid from coaxial cable, a vendor product such as Solder Wick (V34605) or a stranded wire with the insulation removed.
要使用吸芯材料，可使用同轴电缆的屏蔽编织线、焊芯 (V34605) 等供应商产品或去掉绝缘层的绞合导线。
(1) Apply liquid flux to the shield braid or the stranded conductor. Solder Wick comes with flux in it.
在屏蔽编织层或绞合导线上涂抹液体助焊剂。焊芯中含有助焊剂。
(2) Put the wicking material or stranded conductor on the soldered connection and apply the hot tip of a soldering iron on top.
将芯线材料或绞合导线放在焊接连接处，然后将烙铁的热端放在上面。
(3) Let the heated wick soak up the solder as necessary. Then remove the wick and the iron from the joint.
必要时让加热的焊芯浸透焊料。然后从连接处取下焊芯和烙铁。
F. To use a vacuum solder removal tool, apply the heat source to the area, operate the tool to remove the solder as necessary, then remove the tool and the heat source.
使用真空焊料清除工具时，将热源置于该区域，必要时操作工具清除焊料，然后移除工具和热源。
6. HEAT SHRINKING OF SOLDER SLEEVES 焊接套管的热收缩
A. General
通用
WARNING :DO NOT USE INFRARED OR HOT AIR DEVICES IN AREAS WHERE THERE COULD BE FLAMMABLE LIQUIDS, VAPORS, OR GASES.
警告 :不要在有易燃液体、蒸汽或气体的地方使用红外线或热风设备。
(1) The solder sleeve must be in the center of the splice.
焊套必须位于接合处的中心。
(2) Conductor strands must lie flat and not go through the solder sleeve.
导线必须平放，不得穿过焊接套管。
(3) The solder ring must be completely melted and flowed onto the adjacent surfaces.
焊环必须完全熔化并流到邻近表面。
(4) The solder joint must be resistant to a tensile test of 20 pounds or, as a minimum, be as strong as the tensile strength of the wire or braid.
焊点必须能承受 20 磅的拉伸试验，或至少与导线或编织线的拉伸强度相同。
(5) Use Method A, B, C or D as follows:
使用方法 A、B、C 或 D 如下：
(a) For the BACS13BH (Raychem D144) series of solder sleeves, use Method A, C, or D.
对于 BACS13BH（Raychem D144）系列焊套，使用方法 A、C 或 D。
(b) For the M83519/1 series of solder sleeves, use Method A, B, C or D.
对于 M83519/1 系列焊套，使用方法 A、B、C 或 D。
(c) For the obsolete NAS1745 (Raychem D100) series of solder sleeves, use Method B.
对于老式的 NAS1745（Raychem D100）系列焊套，使用方法 B。
(d) For the obsolete NAS1746-2,-3, or -4 solder sleeves, use Method A or B.
对于老式的 NAS1746-2、-3 或 -4 焊套，使用方法 A 或 B。
(6) Do not use solder sleeves on wires with a temperature rating less than 150°C (302°F) or if the conductors are nickel plated. Do not use solder sleeves in high-temperature applications (higher than 150°C (302°F) because the heat could melt the solder sleeve again.
请勿在温度低于 150°C (302°F) 或导体镀镍的导线上使用焊接套管。不要在高温应用中使用焊套（高于 150°C (302°F)），因为高温可能会再次熔化焊套。
B. Method A (Infrared)
方法 A（红外线）
(1) Put the solder sleeve in the center of the reflector of the IR500, IR550, or IR1759 gun.
将焊套放在 IR500、IR550 或 IR1759 喷枪反射器的中心。
(2) Push the switch to operate the gun. Look at the solder sleeve during the shrinking operation.
按下开关操作喷枪。在收缩操作过程中观察焊套。
(3) When you see that the sleeve is melted and flowed, release the switch and remove the sleeve from the reflector.
当看到套管熔化并流动时，松开开关并从反射器上取下套管。
C. Method B (Hot Air)
方法 B （热空气）
(1) Turn on the AA-400, CV-5300 or CV-5700 gun.
打开 AA-400、CV-5300 或 CV-5700 喷枪。
(2) Put the solder sleeve in the center of the reflector gun. Look at the solder sleeve during the shrinking operation.
将焊套放在反射枪的中心。在收缩过程中观察焊套。
(3) When you see that the sleeve is melted and flowed, remove the sleeve from the reflector.
当看到套管熔化并流动时，从反射器上取下套管。
D. Method C (Infrared)
方法 C（红外线）
(1) Fully open the nose cone of the IR1000 or IR1003 zap gun.
完全打开 IR1000 或 IR1003 扎枪的前锥。
(2) Put the solder sleeve and wires within the reflector opening with the wire against the back shields and the solder sleeve in the space between the back shields.
将焊套和导线放在反射器开口内，导线靠在后屏蔽物上，焊套放在后屏蔽物之间的空隙中。
(3) Close the nose cone, and make sure the fingers clamp the wires against the back shields. Then push the actuator switch to start the heat cycle.
关上前锥，确保手指夹住电线，使其紧贴后护板。然后按下致动器开关，启动加热循环。
(4) Remove the solder sleeve assembly 2 to 3 seconds after the lamp goes off.
在灯熄灭 2 至 3 秒后取下焊套组件。
(5) Examine the solder joint. If the timer is correctly set, the solder ring will be completely melted, the adjacent surfaces will be wet with the solder, and the solder surface will be bright and shiny. Decrease the time in 1/4-second increments if too much solder drained from the joint or if the sleeve is burned. Increase the time in 1/4-second increments if the solder is a dull gray color with a grainy surface, or if the solder ring is not completely melted.
检查焊点。如果定时器设置正确，焊环将完全熔化，相邻表面将被焊料浸湿，焊接表面将光亮。如果从焊点流出的焊料过多或套管烧焦，则以 1/4 秒为单位缩短时间。如果焊料颜色暗灰，表面有颗粒，或者焊环没有完全熔化，则以 1/4 秒为单位增加时间。
(6) Make a check of the strength of the connection. Hold each wire between your thumb and forefinger and pull slowly until your thumb and forefinger slip on the wire.
检查连接强度。用拇指和食指夹住每根导线，慢慢拉动，直到拇指和食指在导线上滑动。
E. Method D (Infrared)
方法 D（红外线）
(1) Put the solder sleeve in the ST2021C, ST2021D, or ST2021J heat unit and turn on the infrared lamps.
将焊管放入 ST2021C、ST2021D 或 ST2021J 加热装置中，打开红外线灯。
(2) After the solder ring is melted and flowed, remove the sleeve from the heat unit.
焊环熔化并流动后，将套管从加热装置中取出。